3M™ Through-Board Socket, 9662XX-2000-AR-XX Series

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Available in 6 to 50 pins

Mates with pin headers for board stacking applications

High-dielectric header withstands high temperatures and temp cycling

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PDF (1) Copy 26Tech Data Sheet (PDF, 112KB)
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Details

Highlights
  • Available in 6 to 50 pins
  • Mates with pin headers for board stacking applications
  • High-dielectric header withstands high temperatures and temp cycling
  • Allows for reflow soldering processes
  • Compatible with "no lead" solder reflow

The 3M™ Through-Board Socket, 966 Series is a dual row, 6- to 50-position socket that mates with pin headers from the top and bottom of the PCB for efficient board stacking. The through-hole socket features a low profile for excellent space utilization.

Featuring high-dielectric materials, 3M™ Through-Board Socket, 966 Series is compatible with reflow soldering processes even with no-lead solder.

Specifications

Applications

Board-to-board Connecting

Connector Shape

Rectangular

Connector Style

Receptacle

Contact Base Material

Copper Alloy

Current Rating

2.0

Features

Pick & Place, Bottom or Top Entry

Insulation Color

Black

Insulation Height (Metric)

5 mm

Insulation Material

Thermoplastic

Latch/Ejector Type

Push-in/Pull-out

Mating Contact Finish Material

Gold Flash

Mating Contact Finish Thickness (Metric)

<0.25 µm

Mating Option

Board to Board

Maximum Operating Temperature (Celsius)

105 ℃

Minimum Operating Temperature (Celsius)

-25 ℃

Number of Contact Rows

2

Number of Contacts

6 , 10 , 20 , 30 , 40

PCB Mounting Style

Surface Mount

Pitch (Metric)

0.1 mm

Post Contact Finish Material

Tin

Product Series

966

Specifications Met

UL 94V-0

Tech Sheet Number

TS-2652

Voltage Rating

1000 Vrms at Sea Level

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