3M™ Three-Wall Condo Header, 3000 Series
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Details
Highlights
- Stacked pins conserve space on the circuit board allowing higher density packaging
- Pin quantity to 128 gives design flexibility with latching
- HDI alternative
- Three-wall fits in VME board stacking criteria
- Accepts standard IDC sockets
- Mates with standard flat cable harnesses
- High temperature insulator suitable for "no lead" soldering operations
- A good option for reflow soldering using paste-in-hole techniques
- Easy-to-install latch/ejector with a right-angle design
- For more information, refer to Data Sheet TS0773 (TS-0773)
3M™ Three-Wall Condo Header, 3000 Series is a three-wall header that brings flexibility and reliability to wire-to-board connecting applications and high-density packaging. With stacked pins that conserve space on the circuit board, this header allows for design flexibility with its 128-pin quantity and latching capability. The three-wall design meets VERSA-Module Eurocard (VME) board-stacking criteria, while also accepting standard insulation-displacement contact (IDC) sockets and mating with standard flat cable harnesses.
The high-temperature insulator in 3M™ Three-Wall Condo Header, 3000 Series is a good option for no-lead soldering operations and can be reflow-soldered using paste-in-hole techniques. With the .100 in. x .100 in. latch/ejector and right-angle configuration, this header provides a high-density interconnect (HDI) alternative for wire-to-board connections.
Specifications
Resources
