P05N Series, 0.5mm Board Stack System, Vertical, SMT, 4, 5, & 6 mm Stack Height
Applications | Board-to-board Connecting |
Contact Base Material | Copper Alloy |
Contact Termination Area Plating Material | Gold Flash |
Contact Underplating Material | Nickel |
Contact Underplating Thickness (Metric) | 1.27 µm |
Insulation Resistance | >1x10³ MΩ @ 500 VDC |
Number of Contacts | 60 |
Pitch (Metric) | 0.5 mm |
Specifications Met | UL 94V-0 |
Tech Sheet Number | TS-1092 |
Data Sheets
(PDF, 148KB)
Data Sheets
(PDF, 1MB)
Data Sheets
(PDF, 1MB)