3M™ Test & Burn-In Ball Grid Array Sockets 90XX Series

Highlights

• Double-beam normally-closed contact delivers balanced, opposing forces to solder ball with minimal shear stress
• Contact tips touch ball above its center plane moving ball deformation away from seating plane
• Designed to allow excellent air flow around device
• Includes a retractable locating guide for easy board mounting even with hundreds of leads
• Compatible with most robotic handlers
• Helps provide easy manual operation
• Available in types I, II, III, and IV
• Can reduce lead time and cost with modular tooling and optimal footprint density
• See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
• For more information refer to Data Sheet TS9000 (TS-9000)