951 Series, 2mm Header, Dual Insulator, Straight, Solder Tail
Applications | Board-to-board Connecting |
Contact Base Material | Copper Alloy |
Contact Termination Area Plating Material | Matte Tin |
Contact Termination Area Plating Thickness (Metric) | 1 µm - 3 µm |
Contact Underplating Material | Nickel |
Contact Underplating Thickness (Metric) | 1.25 µm - 2.5 µm |
Insulation Material | High Temperature Thermoplastic |
Insulation Resistance | >5x10⁸ Ω @ 100 VDC |
Moisture Sensitivity Level | 1 (Per J-STD-020C) |
Process Temperature Rating | 260 °C Maximum (Per J-STD-020C) |
Specifications Met | UL 94V-0 |
Tech Sheet Number | TS-2160 |
Data Sheets
(PDF, 99KB)
Data Sheets
(PDF, 689KB)