3M™ Chip Carrier Sockets, 8400 Series, 84XX-11B1-RK-TP
- | Select product options for IDs.
Details
Highlights
- Accepts chip carriers conforming to JEDEC outline MO-047 for square and MO-052 for rectangular
- Compatible with automated loading equipment
- Open top design allows unrestricted air flow
- Molded slots for ease of device extraction
- Wave solder compatible. Not suitable for reflow soldering
- RoHS Compliant. See Regulatory Information Appendix link for chemical compliance information
- For more information, refer to Data Sheet TS2148 (TS-2148)
Low Profile, Four-Row, Through-Hole
Specifications
| Contact Base Material | Copper Alloy |
| Contact Underplating Material | Nickel |
| Contact Underplating Thickness (Metric) | 1.27 µm |
| Current Rating | 1.0 |
| Frame Style/Type | Closed |
| Insulation Material | Glass Filled Polyester (PBT) |
| Integrated Circuit Type | PLCC |
| Mating Contact Finish Material | Matte Tin |
| Mating Contact Finish Thickness (Metric) | 4.06 µm |
| Maximum Operating Temperature (Celsius) | 105 ℃ |
| Minimum Operating Temperature (Celsius) | -40 ℃ |
| Number of Contact Rows | 4 |
| Number of Contacts | 20 , 28 , 32 , 44 , 52 , 68 , 84 |
| PCB Mounting Style | Through Hole |
| Pitch (Metric) | 1.27 mm |
| Tech Sheet Number | TS-2148 |
Resources
3M™ Chip Carrier Sockets LP, 4-Row, T-H 8400 Series, TS2148Data Sheets
(POSTSCRIPT, 932KB)
3M™ Chip Carrier Sockets, 8400 SeriesData Sheets
(PDF, 139KB)
