.100" Vertical, PCB/Backplane, Solder Tail or Press-Fit
Connector Style | Receptacle |
Contact Base Material | Copper Alloy |
Current Rating | 3.0 |
Features | Mating Guide |
Flammability | UL 94V-0 |
Insulation Color | Black |
Insulation Material | Glass Filled Thermoplastic (LCP) |
Insulation Resistance | >1x10³ MΩ @ 500 VDC |
Markings | Part Number and Date Code |
Mating Contact Finish Material | Gold |
Mating Contact Finish Thickness (Metric) | 0.076 µm, 0.76 µm |
Moisture Sensitivity Level | 1 (Per J-STD-020C) |
Mounting Type | Boardmount |
Number of Contact Rows | 4 |
Number of Contacts | 128 , 160 , 200 |
PCB Mounting Style | Through Hole |
Packaged Form | Bulk |
Physical Plating Property | 50 microinches [1.27 micrometers] Min. Nickel |
Pitch (Metric) | 2.54 mm |
Process Rating | Maximum 260 Degree C (per J-STD-020C) |
Product Series | HDC |
Tech Sheet Number | TS-1138 |
Temperature Rating | -55 Degree C to +105 Degree C |
Temperature Rating: USA | -55 Degrees C to +105 Degrees C |
Termination Area | See Ordering Information |
Termination Method | Solder, Press Fit |
UnderPlating Material | 50 micro inches [1.27 micro meter] Min. Nickel |
Wiping Area (Plating) | See Ordering Information |
Withstanding Voltage | 900 VAC for 1 minute |
Data Sheets
(PDF, 1008KB)