3M™ CP2 Press-Fit Header, CP2 Series

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25 mm basic system unit

38, 44 and 50 mm module

2 mm grid spacing allows for high signal density at low cost

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PDF (1) Copy 26Tech Data Sheet (PDF, 948KB)
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Details

Highlights
  • 25 mm basic system unit
  • 38, 44 and 50 mm module
  • 2 mm grid spacing allows for high signal density at low cost
  • “Eye of the Needle” compliant pin press-fit design helps reduce manufacturing time and cost
  • Three contact mating levels for Early Mate Late Break or “Hot Swap” applications help reduce manufacturing time and cost
  • Feed through termination available for midplane applications
  • Additional grounding rows available for improved ground bounce and EMI immunity
  • Mates with 5 row 3M™ MetPak™ HSHM, UHM, and CP2 sockets
  • End to end stackable with 5 row 3M™ MetPak™ HSHM, HSM, HM, and CP2 headers
  • See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
  • For more Information refer to Data Sheet TS2267 (TS-2267)

The 3M™ CP2 Press-Fit Header, CP2 Series helps achieve high signal density in cost-effective applications. Modular headers use a basic unit of 25 mm, and can be designed in versatile 38, 44 or 50 modules with 2 mm grid spacing. Type B 95, 110 and 125, 2 mm signal contacts feature a press-fit pin design that helps verify smooth and accurate connections. Three contact mating levels make these headers excellent for hot swapping and early mate/late break applications.

End-stackable header mates with 5 row 3M™ MetPak™ sockets. The 3M press-fit header, CP2 series is available with additional grounding rows for improved ground bounce and EMI control, as well as feed through termination for midplane applications.

Specifications

Connector Style

Pin Header

Contact Base Material

Copper Alloy

Contact Resistance

<= 20 MilliOhms

Current Rating

1.0

Electrical Load

1.0 Ampere at +70 Degree C

Flammability

UL 94V-0

Insulation Color

Beige

Insulation Material

Glass Filled Polyester (PBT)

Insulation Resistance

>= 10,000 MegaOhm

Mating Contact Finish Material

Gold

Mating Contact Finish Thickness (Metric)

0.76 µm

Mating Force

<= 0.75N/PIN

Mating and Un-mating Operations

50

Mounting Type

Boardmount

Number of Contact Rows

5 , 7

Number of Contacts

125 , 133 , 154 , 175

PCB Mounting Style

Through Hole

PCB Thickness

2.4-5.6 mm

Packaged Form

Bulk

Pitch (Metric)

2 mm

Product Series

CP2

Tech Sheet Number

TS-2267

Temperature Rating

-55 Degree C to +125 Degree C

Termination Method

Press Fit

Test Voltage

750 VAC (rms)

Withdrawl Force

>= 0.15N/PIN

Withstanding Voltage

750 Vrms

Resources

Similar products

Mounting Type Boardmount
Number of Contacts 125 , 133 , 154 , 175
Pitch (Metric) 2 mm
Connector Style Pin Header
Number of Contact Rows 5 , 7