3M™ CP2 Press-Fit Header, CP2 Series

  • Options available
  • | Select product options for IDs.

25 mm basic system unit

50 mm module

2 mm grid spacing allows for high signal density at low cost

View more details
Frequently viewed resources
PDF (1) Copy 26Tech Data Sheet (PDF, 343KB)
icn_down_arrow
icn_down_arrow

Select product options

Contact Us

Details

Highlights
  • 25 mm basic system unit
  • 50 mm module
  • 2 mm grid spacing allows for high signal density at low cost
  • “Eye of the Needle” compliant pin press-fit design reduces manufacturing time and cost
  • Three contact mating levels for Early Mate Late Break or “Hot Swap” applications reduces manufacturing time and cost
  • Feed through termination available for midplane applications
  • Additional grounding rows available for improved ground bounce and EMI immunity
  • Mates with 5 row 3M™ MetPak™ HSHM, UHM, and CP2 sockets
  • End to end stackable with 5 row 3M™ MetPak™ HSHM, HM, and CP2 headers
  • See Regulatory Information Appendix (last page of Tech Data Sheet) for chemical compliance information
  • For more Information refer to Data Sheet TS2265 (TS-2265)

The 3M™ CP2 Press-Fit Header, CP2 Series helps achieve high signal density in cost-effective applications. Modular headers use a basic unit of 25 mm and 50 mm modules, with 2 mm grid spacing. Type 100A 2 mm contacts with press-fit pin design help technicians verify accurate connections, excellent for hot swapping and early mate/late break applications.

End-stackable header mates with 5 row 3M™ MetPak™ sockets. The 3M press-fit header, CP2 series is available with additional grounding rows for greater ground bounce and EMI control as well as feed through termination for midplane applications.

Specifications

Connector Style

Pin Header

Contact Base Material

Copper Alloy

Contact Resistance

<= 20 MilliOhms

Current Rating

1.0

Flammability

UL 94V-0

Insulation Color

Beige

Insulation Material

Glass Filled Polyester (PBT)

Insulation Resistance

>= 10,000 MegaOhm

Mating Contact Finish Material

Gold

Mating Contact Finish Thickness (Metric)

0.25 µm, 0.76 µm

Mating Force

<= 0.75N/PIN

Mating and Un-mating Operations

50

Mounting Type

Boardmount

Number of Contact Rows

5 , 7

Number of Contacts

110 , 154

PCB Mounting Style

Through Hole

Packaged Form

Bulk

Pitch (Metric)

2 mm

Product Series

CP2

Tech Sheet Number

TS-2265

Temperature Rating

-40 Degree C to +85 Degree C

Termination Method

Press Fit

Test Voltage

750 VAC (rms)

Withdrawl Force

>= 0.15N/PIN

Withstanding Voltage

750 Vrms

Resources